Common techniques

Electrical test

1.Connectivity test

2.Electrical tests

3.Function tests

Non-destructive techniques

1.X-Ray

2.CT Scans

3.C-SAM

Sample preparationtechniques

1.De-Cap (mechanical De-Cap, chemical De-cap)

2.DE passivation layer (Chemical etching, plasma etching)

3.Microanalysis technique (FIB, CP)

Microscopic morphology techniques

1.Optical microscopy

2.SEM

Failure Point Positioning technology

1.Thermal Imaging Microscopy (hot spot)

2.LCD hot spot detection technology

3.Light emission microanalysis (EMMI)

Surface Elemental analysis

1.SEM/EDS

2.AES

3.XPS

4.SIMS