Failure Analysis of PCB/PCBAthermal analysis:
appearance inspectiondifferential scanning calorimetry£¨DSC£©
X-ray detectionThermal mechanical analysis (TMA)
Three-dimensional CT detectionThermogravimetric analysis (TGA)
C-SAM detectiondynamic mechanical analysis (DMA)
nfrared thermal imagingCoefficient of thermal conductivity (steady state heat flux method, laser scattering method)
surface element analysis
Scanning electron microscopyand energy spectrum analysis (SEM/EDS)
Micro infrared analysis (FTIR)
Auger electron spectroscopyanalysis (AES)
X-ray photoelectron spectroscopy analysis (XPS)
Secondary ion mass spectrometry (TOF-SIMS)
electric performance test
The breakdown voltage, Voltage resistance, Dielectric constant, Electric migration
destructive inspection
Dyeing and penetration testing
Slice analysis:metallographic, focused ion beam (FIB) sample preparation, ion milling (CP) sample preparation